Metal Ceramic Substrates
Metal Ceramic Substrates are a type of base material used in electronic circuitry, especially in thin film technology. They are made of ceramic materials such as alumina (Al2O3), aluminum nitride (AlN), or silicon carbide (SiC). Ceramic substrates have excellent thermal and chemical resistance, high mechanical strength, superior electrical insulation, and high-frequency signals handling capacity.
In electronic circuitry, ceramic substrates provide a stable surface to mount electronic components and help in signal transmission. They are often used in applications requiring high power, such as power amplifiers, switching regulators, and voltage regulators. Ceramic substrates are also used in hybrid and integrated circuits, sensors, and other electronic devices.
Ceramic substrates have unique properties that make them useful in various industrial applications. They can withstand high-temperature, harsh environment, and chemical exposure. They are also lightweight, durable, and versatile, making them perfect for electronic packaging, automotive, aerospace, and other demanding applications.
Overall, ceramic substrates offer many advantages in electronic and industrial applications where stability, reliability, and high-performance capabilities are critical factors.
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The Torbo®Metal Ceramic Substrates
Item:Metal Ceramic Substrates
Surface processing:Double polished
Bulk density: 3.24g/㎤
Surface roughness Ra: 0.4μm
Bending strength: (3-point method):600-1000Mpa
Modulus of elasticity:310Gpa
Fracture toughness(IF method):6.5 MPa･√m
Thermal conductivity: 25°C 15-85 W/(m･K)
Dielectric loss factor:0.4
Volume resistivity: 25°C >1014 Ω･㎝
Breakdown strength:DC >15㎸/㎜