Electronic Substrate

The Torbo® Electronic Substrates, produced by a Chinese factory, find applications in the electronics industry, particularly in power semiconductor modules, inverters, and converters. They serve as replacements for other insulating materials, resulting in increased production efficiency and decreased overall size and weight. Moreover, their exceptional strength plays a pivotal role in enhancing the longevity and reliability of the end products in which they are employed.

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Product Description

As a professional high quality Electronic Substrate manufacture, you can rest assured to buy Electronic Substrate from our factory and we will offer you the best after-sale service and timely delivery. Electronic substrates, also known as printed circuit board (PCB) substrates, are the foundational materials on which electronic components and circuits are built. These substrates provide a platform for mounting and interconnecting various electronic components, such as integrated circuits, resistors, capacitors, and other electronic devices.

Electronic substrates are typically made from materials like fiberglass-reinforced epoxy, polyimide, or ceramic. They are engineered to have specific properties like electrical insulation, mechanical strength, and thermal stability. The substrate often features a layer of copper traces and conductive pathways that form the circuit connections.

These substrates play a crucial role in modern electronics, serving as the structural support and electrical interconnection medium for electronic devices, from simple consumer electronics to complex computer systems and telecommunications equipment. They come in various types and designs, depending on the application's requirements, such as single-sided PCBs, double-sided PCBs, or multilayer PCBs with intricate circuit designs.

The Torbo® Electronic Substrate

Item:Silicon nitride substrate

Material:Si3N4

Color:Gray

Thickness:0.25-1mm

Surface processing:Double polished

Bulk density: 3.24g/㎤

Surface roughness Ra: 0.4μm

Bending strength: (3-point method):600-1000Mpa

Modulus of elasticity:310Gpa

Fracture toughness(IF method):6.5 MPa･√m

Thermal conductivity: 25°C 15-85 W/(m･K)

Dielectric loss factor:0.4

Volume resistivity: 25°C >1014 Ω･㎝

Breakdown strength:DC >15㎸/㎜

The Torbo® Electronic substrate used in electronics fields such as power semiconductor modules, inverters and converters, replacing other insulating materials to increase production output and reduce size and weight.

Their extremely high strength also makes them a key material that increases the life and reliability of the products they are used in.

Double-sided heat dissipation in power cards (power semiconductors) , power control units for automobiles