Why Does Silicon Nitride Substrate Need to Improve Thermal Conductivity?

Silicon Nitride Substrate is widely used in high-tech fields such as semiconductors and LEDs, but it has a problem - thermal conductivity is not good enough. If the heat cannot be dissipated, the equipment will easily overheat and stop working. Today, let's talk about how to "cool it down" and let the thermal conductivity rise!

1. Pay attention to the material ratio

The ratio of silicon and nitrogen in silicon nitride is not set casually. Experiments have found that when there is more silicon, the crystal structure is tighter and the heat conduction is smoother. However, this degree must be controlled well, too much or too little will not work.

2. There is a trick to sintering temperature

Temperature control is particularly critical during firing. Although too high a temperature can reduce pores, it may make the grains grow too large and affect thermal conductivity. About 1800°C is a golden temperature, which can ensure density and maintain a small grain structure.

3. Fewer impurities

Even a little bit of impurities such as iron and calcium will block heat conduction like a roadblock. Therefore, the purity of the raw materials must reach more than 99.99%, and the production environment must be as clean as possible.

4. Surface treatment cannot be saved

Polish the surface of Silicon Nitride Substrate, and control the roughness at the nanometer level, so that the thermal contact surface is smoother and the heat dissipation efficiency is naturally improved. Some high-end applications will also be coated with metal films to help conduct heat.

5. New ideas for composite modification

The recent research hotspot is to add silicon carbide nanoparticles to silicon nitride, or use graphene as a reinforcement material. These methods can increase thermal conductivity by more than 30%, but the cost is also rising.

Future Outlook

The laboratory is now trying to 3D print silicon nitride structures to optimize the heat conduction path by precisely controlling the distribution of holes. Maybe in a few years, we will be able to use a new generation of substrates with doubled thermal conductivity!

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