Ceramic Substrate Production Method

Ceramic substrate production method:

Typical forming methods in front of ceramics have four types: powder press forming (molded, etc.), extrusion forming, cast form, and is formed. The casting method is used in the manufacture of substrates for LSI packages and mixed integrated circuits due to easily achievement and high production efficiency, in recent years. Common three craft routes are as follows:

1. A laminated - hot press 1 degreasic, a substrate, a formation circuit pattern - - circuit burn;

2. Laminated surface printed circuit graphic is hot press-degreasing a total of burning;

3. Printed circuit graphics a stack of hot press--degreasing a total of burning.