The Difference Between Different Light Sources Cutting Ceramic Substrate
2021-08-04
Different light sources (UV, green light, infrared) Cutting ceramic substrate
Difference 1:
Infrared fiber laser cutting ceramic substrate, the wavelength employed is 1064 nm, and the wavelength of green light is 532 nm, and ultraviolet wavelength is 355 nm.
Infrared fiber lasers can make greater power, and the heat affected zone is also greater;
Green light relative fiber lasers should be slightly better, the heat affected zone is small;
The ultraviolet laser cutting ceramic substrate is a machining mode of the material molecular bond. The heat affected area is the smallest, which is also slight carbonization in the process of cutting the non-metallic PCB circuit board, and the ultraviolet laser can be carbonized. Even completely carbonation reasons.
Difference 1:
Infrared fiber laser cutting ceramic substrate, the wavelength employed is 1064 nm, and the wavelength of green light is 532 nm, and ultraviolet wavelength is 355 nm.
Infrared fiber lasers can make greater power, and the heat affected zone is also greater;
Green light relative fiber lasers should be slightly better, the heat affected zone is small;
The ultraviolet laser cutting ceramic substrate is a machining mode of the material molecular bond. The heat affected area is the smallest, which is also slight carbonization in the process of cutting the non-metallic PCB circuit board, and the ultraviolet laser can be carbonized. Even completely carbonation reasons.
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